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IRF530N
TM
Data Sheet
March 2000
File Number
4843
22A, 100V, 0.064 Ohm, N-Channel Power MOSFET Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE
Features
* Ultra Low On-Resistance - rDS(ON) = 0.064, VGS = 10V * Simulation Models - Temperature Compensated PSPICETM and SABER(c) Electrical Models - Spice and SABER(c) Thermal Impedance Models - www.intersil.com * Peak Current vs Pulse Width Curve * UIS Rating Curve
DRAIN (FLANGE)
Symbol
D
Ordering Information
PART NUMBER IRF530N
G
PACKAGE TO-220AB
BRAND IRF530N
S
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified IRF530N UNITS V V V A A 100 100 20 22 15 Figure 4 Figures 6, 14, 15 85 0.57 -55 to 175 300 260 W W/oC
oC oC oC
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TC= 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC= 100oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg NOTES:
1. TJ = 25oC to 150oC. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures. PSPICE(R) is a registered trademark of MicroSim Corporation. SABER(c) is a Copyright of Analogy Inc. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright (c) Intersil Corporation 2000
IRF530N
Electrical Specifications
PARAMETER OFF STATE SPECIFICATIONS Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current BVDSS IDSS ID = 250A, VGS = 0V (Figure 11) VDS = 95V, VGS = 0V VDS = 90V, VGS = 0V, TC = 150oC Gate to Source Leakage Current ON STATE SPECIFICATIONS Gate to Source Threshold Voltage Drain to Source On Resistance THERMAL SPECIFICATIONS Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient RJC RJA TO-220 1.76 62
oC/W oC/W
TC = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
100 -
-
1 250 100
V A A nA
IGSS
VGS = 20V
VGS(TH) rDS(ON)
VGS = VDS, ID = 250A (Figure 10) ID = 22A, VGS = 10V (Figure 9)
2 -
0.054
4 0.064
V
SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge at 10V Threshold Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) 790 215 70 pF pF pF Qg(TOT) Qg(10) Qg(TH) Qgs Qgd VGS = 0V to 20V VGS = 0V to 10V VGS = 0V to 2V VDD = 50V, ID = 22A, Ig(REF) = 1.0mA (Figures 13, 16, 17) 43 23 1.7 3.5 8.7 52 28 2 nC nC nC nC nC tON td(ON) tr td(OFF) tf tOFF VDD = 50V, ID = 22A VGS = 10V, RGS = 13 (Figures 18, 19) 7.9 42 47 39 75 130 ns ns ns ns ns ns
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage SYMBOL VSD ISD = 22A ISD = 11A Reverse Recovery Time Reverse Recovered Charge trr QRR ISD = 22A, dISD/dt = 100A/s ISD = 22A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.25 1.00 100 313 UNITS V V ns nC
2
IRF530N Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 175 TC , CASE TEMPERATURE (oC)
25
ID, DRAIN CURRENT (A)
20 VGS = 10V 15
10
5
0
25
50
75
100
125
150
175
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
2 1 THERMAL IMPEDANCE ZJC, NORMALIZED DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.1 t1 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 t, RECTANGULAR PULSE DURATION (s) 10-1 100 101
SINGLE PULSE 0.01 10-5 10-4
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
300 TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: 100 I = I25 VGS = 10V 175 - TC 150
IDM, PEAK CURRENT (A)
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 10 10-5 10-4 10-3 10-2 t, PULSE WIDTH (s) 10-1 100 101
FIGURE 4. PEAK CURRENT CAPABILITY
3
IRF530N Typical Performance Curves
300 SINGLE PULSE TJ = MAX RATED TC = 25oC
(Continued)
100
ID, DRAIN CURRENT (A)
100
100s 10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
IAS, AVALANCHE CURRENT (A)
If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
STARTING TJ = 25oC STARTING TJ = 150oC
1ms 10ms 100 300
10 0.001
0.01
0.1
1
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322. FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
40 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V 30
40
VGS = 20V VGS = 10V
VGS = 7V VGS = 6V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
30
20 TJ = 175oC 10
20
VGS =5V
TJ = -55oC TJ = 25oC
10
0 2 3 4 5 VGS, GATE TO SOURCE VOLTAGE (V) 6
0
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TC = 25oC 0 1 2 3 VDS, DRAIN TO SOURCE VOLTAGE (V) 4
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
3.0 NORMALIZED DRAIN TO SOURCE ON RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX 2.5
VGS = 10V, ID = 22A
NORMALIZED GATE THRESHOLD VOLTAGE
1.2 VGS = VDS, ID = 250A
2.0 1.5 1.0 0.5 0 -80 -40 160 0 40 80 120 TJ, JUNCTION TEMPERATURE (oC) 200
1.0
0.8
0.6 -80 -40 0 40 80 120 160 200 TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
4
IRF530N Typical Performance Curves
1.2
NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE
(Continued)
2000 VGS = 0V, f = 1MHz 1000
C, CAPACITANCE (pF)
ID = 250A
1.1
CISS = CGS + CGD COSS CDS + CGD
1.0
100 CRSS = CGD
0.9 -80 -40 0 40 80 120 160 200 TJ , JUNCTION TEMPERATURE (oC)
20 0.1
1.0
10
100
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
10
VGS , GATE TO SOURCE VOLTAGE (V)
VDD = 50V 8
6
4 WAVEFORMS IN DESCENDING ORDER: ID = 22A ID = 11A 0 5 15 10 Qg, GATE CHARGE (nC) 20 25
2
0
NOTE: Refer to Intersil Application Notes AN7254 and AN7260. FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
0V
IAS 0.01
0 tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
5
IRF530N Test Circuits and Waveforms
(Continued)
VDS RL VDD VDS VGS = 20V VGS
+
Qg(TOT)
Qg(10) VDD VGS VGS = 2V 0 Qg(TH) Qgs Ig(REF) 0 Qgd VGS = 10V
DUT Ig(REF)
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORMS
VDS
tON td(ON) RL VDS
+
tOFF td(OFF) tr tf 90%
90%
VGS
VDD DUT 0
10% 90%
10%
RGS VGS VGS 0 10% 50% PULSE WIDTH 50%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
FIGURE 19. SWITCHING TIME WAVEFORM
6
IRF530N PSPICE Electrical Model
.SUBCKT IRF530N 2 1 3 ;
CA 12 8 1.27e-9 CB 15 14 1.27e-9 CIN 6 8 7.20e-10 DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DPLCAP 10 5 DPLCAPMOD
10
rev 15 Jan 2000
LDRAIN DPLCAP 5 RLDRAIN DBREAK 11 + 17 EBREAK 18 DRAIN 2 RSLC1 51 ESLC 50
RSLC2
5 51
ESG 6 8 + LGATE GATE 1 RLGATE CIN EVTEMP RGATE + 18 22 9 20 EVTHRES + 19 8 6
IT 8 17 1 LDRAIN 2 5 1.0e-9 LGATE 1 9 5.53e-9 LSOURCE 3 7 4.35e-9 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 2.70e-2 RGATE 9 20 2.50 RLDRAIN 2 5 10 RLGATE 1 9 55.3 RLSOURCE 3 7 43.5 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 1.77e-2 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
MSTRO LSOURCE 8 RSOURCE RLSOURCE 7 SOURCE 3
S1A 12 S1B CA 13 + EGS 6 8 13 8
S2A 14 13 S2B CB + EDS 5 8 14 IT 15 17
-
-
VBAT 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*43.5),3.5))} .MODEL DBODYMOD D (IS = 6.0e-13 RS = 6.2e-3 XTI = 5.5 TRS1 = 2.1e-3 TRS2 = 2.0e-6 CJO = 8.50e-10 TT = 6.30e-8 M = 0.54) .MODEL DBREAKMOD D (RS = 5.6e-1 TRS1 = 8e-4 TRS2 = 3e-6) .MODEL DPLCAPMOD D (CJO = 9.29e-10 IS = 1e-30 M = 0.79) .MODEL MMEDMOD NMOS (VTO = 3.21 KP = 5 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 2.50) .MODEL MSTROMOD NMOS (VTO = 3.60 KP = 37 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO = 2.77 KP = 0.09 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 25.0 ) .MODEL RBREAKMOD RES (TC1 =1.05e-3 TC2 = -5e-7) .MODEL RDRAINMOD RES (TC1 = 1.20e-2 TC2 = 3.00e-5) .MODEL RSLCMOD RES (TC1 = 3.20e-3 TC2 = 3.00e-6) .MODEL RSOURCEMOD RES (TC1 = 1e-3 TC2 = 1e-6) .MODEL RVTHRESMOD RES (TC1 = -2.20e-3 TC2 = -9.00e-6) .MODEL RVTEMPMOD RES (TC1 = -2.40e-3 TC2 =1.80e-6) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2BMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -6.2 VOFF= -3.1) VON = -3.1 VOFF= -6.2) VON = -1.0 VOFF= 0.5) VON = 0.5 VOFF= -1.0)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
7
+
-
EBREAK 11 7 17 18 117.8 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1
RDRAIN 21 16
DBODY
MWEAK MMED
RBREAK 18 RVTEMP 19
VBAT +
8 22 RVTHRES
IRF530N SABER Electrical Model
REV 15 Jan 2000 template IRF530N n2,n1,n3 electrical n2,n1,n3 { var i iscl d..model dbodymod = (is = 6.00e-13, cjo = 8.50e-10, tt = 6.30e-8, xti = 5.5, m = 0.54) d..model dbreakmod = () d..model dplcapmod = (cjo = 9.29e-10, is = 1e-30, m = 0.79) m..model mmedmod = (type=_n, vto = 3.21, kp = 5, is = 1e-30, tox = 1) m..model mstrongmod = (type=_n, vto = 3.60, kp = 37, is = 1e-30, tox = 1) m..model mweakmod = (type=_n, vto = 2.77, kp = 0.09, is = 1e-30, tox = 1) sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -6.2, voff = -3.1) DPLCAP sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -3.1, voff = -6.2) 10 sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -1.0, voff = 0.5) sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.5, voff = -1.0) c.ca n12 n8 = 1.27e-9 c.cb n15 n14 = 1.27e-9 c.cin n6 n8 = 7.20e-10 d.dbody n7 n71 = model=dbodymod d.dbreak n72 n11 = model=dbreakmod d.dplcap n10 n5 = model=dplcapmod i.it n8 n17 = 1 l.ldrain n2 n5 = 1e-9 l.lgate n1 n9 = 5.53e-9 l.lsource n3 n7 = 4.35e-9
GATE 1 RLGATE CIN LGATE RSLC2 ISCL
LDRAIN 5 RLDRAIN RDBREAK 72 DBREAK 11 MWEAK MMED MSTRO 8 EBREAK + 17 18 71 RDBODY DRAIN 2 RSLC1 51
ESG + EVTEMP RGATE + 18 22 9 20 6 6 8 EVTHRES + 19 8
50 RDRAIN 21 16
DBODY
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u res.rbreak n17 n18 = 1, tc1 = 1.05e-3, tc2 = -5.0e-7 res.rdbody n71 n5 = 6.2e-3, tc1 = 2.10e-3, tc2 = 2.0e-6 res.rdbreak n72 n5 = 5.6e-1, tc1 = 8.0e-4, tc2 = 3.0e-6 res.rdrain n50 n16 = 2.70e-2, tc1 = 1.20e-2, tc2 = 3.00e-5 res.rgate n9 n20 = 2.50 res.rldrain n2 n5 = 10 res.rlgate n1 n9 = 55.3 res.rlsource n3 n7 = 43.5 res.rslc1 n5 n51 = 1e-6, tc1 = 3.2e-3, tc2 = 3.0e-6 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 1.77e-2, tc1 = 1e-3, tc2 = 1e-6 res.rvtemp n18 n19 = 1, tc1 = -2.4e-3, tc2 = 1.8e-6 res.rvthres n22 n8 = 1, tc1 = -2.2e-3, tc2 = -9.0e-6 spe.ebreak n11 n7 n17 n18 = 117.8 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 spe.evthres n6 n21 n19 n8 = 1 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc=1 equations { i (n51->n50) +=iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/43.5))** 3.5)) } }
S1A 12 13 8 S1B CA 13 + EGS 6 8 S2A 14 13 S2B
-
LSOURCE 7 RLSOURCE
SOURCE 3
RSOURCE RBREAK 17 18 RVTEMP CB + EDS 5 8 14 IT 19
15
VBAT +
-
-
8 RVTHRES
22
8
IRF530N SPICE Thermal Model
REV 15 Jan 2000 IRF530NT CTHERM1 th 6 1.40e-3 CTHERM2 6 5 5.55e-3 CTHERM3 5 4 5.65e-3 CTHERM4 4 3 6.10e-3 CTHERM5 3 2 9.80e-3 CTHERM6 2 tl 7.70e-2 RTHERM1 th 6 1.10e-2 RTHERM2 6 5 5.80e-2 RTHERM3 5 4 1.35e-1 RTHERM4 4 3 3.60e-1 RTHERM5 3 2 4.13e-1 RTHERM6 2 tl 4.30e-1
th JUNCTION
RTHERM1
CTHERM1
6
RTHERM2
CTHERM2
5
SABER Thermal Model
SABER thermal model IRF530NT template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 6 = 1.40e-3 ctherm.ctherm2 6 5 = 5.55e-3 ctherm.ctherm3 5 4 = 5.65e-3 ctherm.ctherm4 4 3 = 6.10e-3 ctherm.ctherm5 3 2 = 9.80e-3 ctherm.ctherm6 2 tl = 7.70e-2 rtherm.rtherm1 th 6 = 1.10e-2 rtherm.rtherm2 6 5 = 5.80e-2 rtherm.rtherm3 5 4 = 1.35e-1 rtherm.rtherm4 4 3 = 3.60e-1 rtherm.rtherm5 3 2 = 4.13e-1 rtherm.rtherm6 2 tl = 4.30e-1 }
RTHERM3
CTHERM3
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
tl
CASE
9
IRF530N TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
A OP Q H1 D E1 45o D1 TERM. 4 E A1
INCHES SYMBOL A A1 b b1 c D D1 E E1 e e1 MIN 0.170 0.048 0.030 0.045 0.014 0.590 0.395 MAX 0.180 0.052 0.034 0.055 0.019 0.610 0.160 0.410 0.030 0.100 TYP 0.200 BSC 0.235 0.100 0.530 0.130 0.149 0.102 0.255 0.110 0.550 0.150 0.153 0.112
MILLIMETERS MIN 4.32 1.22 0.77 1.15 0.36 14.99 10.04 MAX 4.57 1.32 0.86 1.39 0.48 15.49 4.06 10.41 0.76 2.54 TYP 5.08 BSC 5.97 2.54 13.47 3.31 3.79 2.60 6.47 2.79 13.97 3.81 3.88 2.84 NOTES 3, 4 2, 3 2, 3, 4 5 5 6 2 -
L1
b1 b c
L 60o 1 2 3
e e1
J1
H1 J1 L L1 OP Q
NOTES: 1. These dimensions are within allowable dimensions of Rev. J of JEDEC TO-220AB outline dated 3-24-87. 2. Lead dimension and finish uncontrolled in L1. 3. Lead dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder coating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 7. Controlling dimension: Inch. 8. Revision 2 dated 7-97.
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10

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